The pull strength of a wire – bonded lead for an integrated circuit is monitored. The following…

The pull strength of a wire-bonded lead for an integrated circuit is monitored. The following table provides data for 20 samples each of size three.
(a) Using all the data find trial control limits for x̄ and R charts. Round your answers to 2 decimal places (e.g. 98.76).
x̄ Control Limits: UCL – CL – LCL
R Control Limits: UCL – CL – LCL
(b) Construct x̄ and R control charts using the control limits from part (a) to identify out-of-control points. (Use Minitab, Excel or any other statistical software.) Does the process appear to be in control or out-of-control? How many of the subgroups fall outside the control limits on both charts combined. (If none are outside the limits, type “0”.)